Nokia Siemens MWC

Nokia Siemens to unveil HSPA + Multiflow technology at MWC

The Mobile World Congress is nearing and it is the time to see some smartphones and tablets getting unveiled. However, there is something more to see there, some latest technology of course.



Nokia Siemens is learned to be unveiling HSPA+ Multiflow technology at the event. It is a technology that will allow a cell phone to talk to two towers at once.

The HSPA+ Multiflow technology means that when your phone is located near to the mobile base station edge, it can also connect simultaneously to the neighboring second base to enable data transfer second path.
According to the company, this new technology will make more efficient use of resources of the networks in delivering twice the data speed.

Be there at the MWC to get a glimpse of a live demonstration of this technology by Nokia Siemens.